Gap Pads, Phase-Change Films, and Thermally Conductive Sheets
Thermal Interface Materials
Thermal interface materials (TIMs) fill microscopic air gaps between heat-generating components and heatsinks or enclosures, providing a low-resistance thermal path. We stock silicone gap pads, phase-change films, electrically isolating pads, and graphite-enhanced sheets for electronics cooling, power conversion, LED assemblies, and battery thermal management.
At a Glance
Temperature Range
Form-dependent: silicone gap pads -60 °C to +200 °C continuous; phase-change films -40 °C to +125 °C; non-silicone PU isolating pads -40 °C to +125 °C
Thickness Range
0.1 mm to 5.0 mm
Available Forms
Colours
Technical Properties
Typical values across stocked grades. Specific grade data sheets available on request.
Physical Characteristics
Density
1.5–3.5 g/cm³
Thermal Conductivity
1.0–12.0 W/m·K (grade dependent)
Dielectric Strength
3–15 kV (isolating grades)
Chemical Resistance
Resistant To
- Thermal cycling and ageing
- Most electronics cleaning solvents (IPA, flux removers)
- Silicone oils (silicone-based grades)
- Moisture and humidity
Limited Resistance
- Prolonged hydrocarbon solvent immersion
- Strong acids and alkalis
Not Recommended
- Direct contact with fuels or aggressive solvents (non-silicone grades)
- Continuous outdoor UV exposure without enclosure
Environmental Ratings
Flame Rating
UL 94 V-0 (most grades)
Standards & Certifications
Standards Compliance
Certifications
Common Applications
- Power electronics and IGBT module cooling
- LED lighting heatsink interfaces
- EV battery cell-to-pack thermal management
- Telecommunications equipment and base stations
- Server and data centre processor cooling
- Industrial motor drive heat dissipation
- Medical device electronics enclosures
- Automotive ECU and inverter assemblies
Not Recommended For
- Silicone-based TIMs can cause contamination in optical or certain coating processes; use silicone-free alternatives where silicone migration is a concern
- Phase-change materials require initial activation above their transition temperature, so performance improves after the first thermal cycle
- Graphite-enhanced pads are electrically conductive. Do not use where electrical isolation between component and heatsink is required
- Softer gap pads (Shore 00 20) may squeeze out under excessive clamping pressure, so follow manufacturer torque guidelines
- Thermal conductivity values are measured under controlled lab conditions; actual performance depends on surface flatness, contact pressure, and joint geometry
Available Grades
Silicone Thermal Gap Pad
Soft, conformable silicone elastomer filled with ceramic or boron nitride particles. Thermal conductivity typically 1.5–6.0 W/m·K. Compresses to fill gaps of 0.5–5.0 mm between uneven surfaces. The most common general-purpose TIM for electronics assemblies.
Phase-Change TIM
Thin film that transitions from solid to semi-liquid at operating temperature (typically 45–55 °C), wetting both surfaces to minimise thermal impedance. Extremely low bond-line thickness after activation. Suited to high-performance processor and GPU applications.
Electrically Isolating Thermal Pad
Ceramic-filled silicone or silicone-free pad providing both thermal conductivity (1.0–5.0 W/m·K) and high dielectric strength (5–15 kV). Used where the heat path must also serve as an electrical barrier — power transistors, MOSFETs, and voltage regulators mounted to grounded heatsinks.
Graphite-Enhanced TIM Pad
Natural or synthetic graphite sheet, sometimes laminated with a polymer binder, offering very high in-plane thermal conductivity: 200–1500 W/m·K (Panasonic PGS, T-Global T68, Henkel APG); annealed pyrolytic graphite up to ~1700 W/m·K. Through-plane conductivity is much lower at 1–10 W/m·K — this anisotropy is the engineering point. Electrically conductive. Used in high-power applications where heat must spread laterally before transferring to the heatsink.
Speciality TIM Compound Sheets
Application-specific formulations including silicone-free pads for optical environments, low-outgassing variants for aerospace, and high-temperature grades for power generation electronics. Properties tailored to the end-use requirements.
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Need Thermal Interface Materials?
We supply thermal interface materials in sheet, roll, and custom die-cut forms. Contact our team for pricing, data sheets, or technical assistance.
Disclaimer
This resource is provided for general engineering reference only and does not constitute professional advice, specification, or guarantee of performance. Actual results depend on specific application conditions. Universal Gaskets Pty Ltd accepts no responsibility or liability for decisions made based on this information. For full terms, see our Terms & Conditions.